The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
May. 19, 2005
Hideki Ishii, Tokyo, JP;
Hideki Ishii, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor package on the first semiconductor chip, and a first molded resin encompassing the first semiconductor chip and the built-in semiconductor package. The built-in semiconductor package includes at least one second semiconductor chip mounted on a die pad, and the second semiconductor chip has a plurality of terminals. Also, the built-in semiconductor package includes a plurality of lead frames, and each of the lead frames is electrically connected with respective one of the terminals of the second semiconductor chip, and has a connection region on one side and a support region on the other opposing side. Further, the built-in semiconductor package a second molded resin encompassing the die pad, the second semiconductor chip, and the lead frames so that each of the connection regions is exposed and each of the support regions is covered. While the second molded resin has top and bottom surfaces, a plane flush with the connection region locates between the top and bottom surfaces of the second molded resin.