The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
Jan. 14, 2003
Wei Feng Lin, Hsinchu, TW;
Chung Ju Wu, Kaohsiung, TW;
Wen-yu Lo, Taichung, TW;
Wen-dong Yen, Tainan, TW;
Wei Feng Lin, Hsinchu, TW;
Chung Ju Wu, Kaohsiung, TW;
Wen-Yu Lo, Taichung, TW;
Wen-Dong Yen, Tainan, TW;
Silicon Integrated Systems Corp., Hsin Chu, TW;
Abstract
A substrate used in a semiconductor device. The substrate includes a first wiring layer, a second wiring layer, and an interconnection-wiring layer. The first wiring layer includes a plurality of first pads, and the second wiring layer includes a plurality of second pads. The interconnection-wiring layer is set between the first and second wiring layer. In this case, at least one of the second pads that does not electrically connect to anyone of the first pads electrically connects to the interconnection-wiring layer. In another case, a shielding portion, which electrically connects the interconnection-wiring layer, is provided around the second pad that doesn't electrically connect to anyone of the first pads. Furthermore, this invention also discloses a semiconductor device including the substrate.