The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
Sep. 22, 2004
Applicant:
Kuniyasu Matsui, Hotaka-machi, JP;
Inventor:
Kuniyasu Matsui, Hotaka-machi, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An intermediate chip for electrically connecting semiconductor chips includes: a substrate having a first side and a second side; a trans-substrate conductive plug which projects to the first side of the substrate; a post electrode which is displaced from the trans-substrate conductive plug in plan view on the second side of the substrate; and wiring which is disposed in or on the substrate for coupling the trans-substrate conductive plug and the post electrode.
Published as:
CN1601727A; KR20050030864A; TW200512894A; US2005104219A1; TWI251313B; KR100687980B1; US7193308B2; CN100440488C;