The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Apr. 30, 2004
Kazumitsu Seki, Nagano, JP;
Takashi Yoshie, Nagano, JP;
Harunobu Sato, Nagano, JP;
Yoshihito Miyahara, Nagano, JP;
Kazumitsu Seki, Nagano, JP;
Takashi Yoshie, Nagano, JP;
Harunobu Sato, Nagano, JP;
Yoshihito Miyahara, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A packaging component used for constituting a package mounting a semiconductor element, and a semiconductor package using the packaging component. The packaging component has on at least a portion of the surface thereof a covered surface which is sealed with an insulating resin or on which an adhesive layer is applied, and the packaging component comprises a conductor substrate and an electrically conducting layer partly or entirely covering the surface thereof, and the electrically conducting layer comprises a rough-surface plated layer having a roughened surface profile on the covered surface. The packaging component includes, for example, a lead frame and a heat-radiating or heat-dissipating plate.