The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7189641 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 13, 2007

Filed:

Aug. 18, 2004
Applicants:

Sang-woo Lee, Seoul, KR;

Gil-heyun Choi, Gyeonggi-do, KR;

Jong-myeong Lee, Gyeonggi-do, KR;

Kyung-in Choi, Gyeonggi-do, KR;

Inventors:

Sang-Woo Lee, Seoul, KR;

Gil-Heyun Choi, Gyeonggi-do, KR;

Jong-Myeong Lee, Gyeonggi-do, KR;

Kyung-In Choi, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method forming a tungsten contact can include forming a contact hole in an interlayer dielectric layer to expose a portion of an underlying silicon based substrate and to form a side wall of the contact hole. A tungsten silicide layer can be formed on at least on the exposed portion of the substrate. A tungsten nitride layer can be conformally formed on a surface of the interlayer dielectric layer, on the tungsten silicide layer and on the side wall. A contact tungsten layer can be formed on the tungsten nitride layer to fill the contact hole. Related apparatus and contacts are also disclosed.


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Lee, Sang-Woo. (2007). Methods of fabricating tungsten contacts with tungsten nitride barrier layers in semiconductor devices, tungsten contacts with tungsten nitride barrier layers (U.S. Patent No. 7189641). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7189641

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