The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2007

Filed:

Sep. 08, 2003
Applicants:

Philippe Coronel, Barraux, FR;

Christophe Regnier, St. Hilaire du Touvet, FR;

François Wacquant, St. Ismier, FR;

Thomas Skotnicki, Crolles, FR;

Inventors:

Philippe Coronel, Barraux, FR;

Christophe Regnier, St. Hilaire du Touvet, FR;

François Wacquant, St. Ismier, FR;

Thomas Skotnicki, Crolles, FR;

Assignee:

STMicroelectronics S.A., Montrouge, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for forming portions of a compound material within an electronic circuit includes the formation of a cavity having at least one opening facing onto an access surface. The cavity furthermore has an internal wall with at least one region made of an initial material (for example, silicon). A metal is deposited close to the region of initial material. The circuit is then heated to form a portion of the compound material (for example, a silicide) in the region of initial material inside the cavity. The compound material is formed from elements of the initial material and from some of the metal deposited. The excess metal that has not formed some of the compound material is then removed from the cavity.


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