The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2007

Filed:

Feb. 23, 2005
Applicants:

Daisuke Ito, Nagano, JP;

Toshimi Kawahara, Nagano, JP;

Inventors:

Daisuke Ito, Nagano, JP;

Toshimi Kawahara, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/26 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method for manufacturing a semiconductor device by processing of a wafer level, in the case of forming the semiconductor device at the wafer level, on the basis of inspection results on individual semiconductor chips constituting a semiconductor wafer, a treatment for forming a circuit including a rewiring pattern is performed with respect to a semiconductor chip judged as a conforming product and a treatment in which a rewiring pattern is not formed in order to avoid having adverse influence on a semiconductor device of a conforming product or an inspection apparatus in an inspection of a formed semiconductor device after forming the semiconductor device is performed with respect to a semiconductor chip judged as a nonconforming product.


Find Patent Forward Citations

Ito, Daisuke. (2007). Manufacturing method of semiconductor device (U.S. Patent No. 7186575). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7186575

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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