The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2007

Filed:

Jun. 23, 2003
Applicants:

Hung-wen Lee, Hsin-Chu, TW;

Ching-ping Wu, Hsin-Chu, TW;

Yen-huei Su, Hsin-Chu, TW;

Inventors:

Hung-Wen Lee, Hsin-Chu, TW;

Ching-Ping Wu, Hsin-Chu, TW;

Yen-Huei Su, Hsin-Chu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 85/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wafer-shipping device and a wafer storage method for protecting bonding pads from fluoridation. First, at least one through hole is drilled in the shipping box. The wafer is then placed in the shipping box. A packaging bag containing the shipping box is put into a vacuum packaging machine to remove air from the packaging bag and the shipping box. A dry inert gas is then introduced into the packaging bag and the shipping box until approaching atmospheric pressure as so to prevent the shipping box from collapse. The packaging bag is then sealed.


Find Patent Forward Citations

Lee, Hung-Wen. (2007). Wafer shipping device and storage method for preventing fluoridation in bonding pads (U.S. Patent No. 7185764). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7185764

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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