The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Sep. 23, 2004
Si-hoon Lee, Gyeonggi-do, KR;
Sa-yoon Kang, Seoul, KR;
Dong-han Kim, Gyeonggi-do, JP;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A tape circuit substrate comprises a base film made of an insulating material, and a wiring pattern layer which is formed on the base film and has first leads that are connected to electrode pads arranged near a periphery of a semiconductor chip and second leads that are connected to electrode pads arranged near the center of the semiconductor chip. The semiconductor chip package comprises a semiconductor chip electrically bonded to the tape circuit substrate through chip bumps. In such a case, each of the leads is configured such that a tip end thereof to be bonded to the electrode pad has a width larger than that of a body portion thereof. According to the present invention, since the interval between the lead and the electrode pad can be made even narrower, a fine pitch semiconductor device can be realized.