The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Jul. 16, 2004
Applicants:
Hiroshi Shiho, Tokyo, JP;
Yukio Hosaka, Tokyo, JP;
Kou Hasegawa, Tokyo, JP;
Nobuo Kawahashi, Tokyo, JP;
Inventors:
Hiroshi Shiho, Tokyo, JP;
Yukio Hosaka, Tokyo, JP;
Kou Hasegawa, Tokyo, JP;
Nobuo Kawahashi, Tokyo, JP;
Assignee:
JSR Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chemical mechanical polishing pad. The pad contains a water-insoluble matrix and Water-soluble particles dispersed in the water-insoluble matrix material and has a polishing surface and a non-polishing surface on a side opposite to the polishing surface. The pad has a light transmitting area which optically communicates from the polishing surface to the non-polishing surface. The non-polishing surface of the light transmitting area has a surface roughness (Ra) of 10 pm or less.