The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Oct. 03, 2005
John M. Boyd, Hillsboro, OR (US);
Fritz Redeker, Fremont, CA (US);
Jason Ryder, Oakland, CA (US);
Aleksander Owczarz, San Jose, CA (US);
John M. Boyd, Hillsboro, OR (US);
Fritz Redeker, Fremont, CA (US);
Jason Ryder, Oakland, CA (US);
Aleksander Owczarz, San Jose, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
An apparatus for cleaning a semiconductor wafer edge is provided. The apparatus includes a film with an abrasive layer configured to contact the edge surface of a semiconductor substrate coated with a contaminant residue layer. A first reel having the film wound thereon and a second reel for receiving the film fed from the first reel are included. In one embodiment, a third reel configured to force the abrasive layer of the film against the edge surface of the semiconductor substrate so as to create an area of contact between the abrasive layer and the edge surface of the semiconductor substrate; and a pin that protrudes from to the top surface of the third reel. A system and method for cleaning a semiconductor wafer edge are also provided.