The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Dec. 12, 2003
Satoru Konishi, Saku, JP;
Tsuneo Endoh, Komoro, JP;
Hirokazu Nakajima, Saku, JP;
Masaaki Tsuchiya, Tobu, JP;
Satoru Konishi, Saku, JP;
Tsuneo Endoh, Komoro, JP;
Hirokazu Nakajima, Saku, JP;
Masaaki Tsuchiya, Tobu, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
The present invention realizes the miniaturization of a semiconductor module. The semiconductor module includes a module board having external electrode terminals and a heat radiation pad over a lower surface thereof, a first semiconductor chip incorporating an initial-stage transistor of a high frequency power amplifying device therein, a second semiconductor chip incorporating a next-stage transistor and a final-stage transistor therein, and an integrated passive device which constitutes a matching circuit. At least one of the first semiconductor chip and the second semiconductor chip and the integrated passive device are mounted over an upper surface of the module board in an overlapped manner.