The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
May. 19, 2004
Chun-wen Cheng, Hsinchu, TW;
Chia-wen Liang, Hsinchu, TW;
Richard Lee, Boashan Township, Hsinchu County, TW;
Vincent Hsueh, Hsinchu, TW;
Chun-Wen Cheng, Hsinchu, TW;
Chia-Wen Liang, Hsinchu, TW;
Richard Lee, Boashan Township, Hsinchu County, TW;
Vincent Hsueh, Hsinchu, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A fuse structure for a semiconductor device is provided. The fuse structure includes a fuse layer between the upper and lower insulating layers. The fuse layer is connected to the other metal layers through the via plugs. The fuse layer includes at least two separate blocks and at least a connecting block. For the current flowing through the separated blocks in a zig-zag path, of the fuse structure provides at least a fusing point or more than one fusing points. In this way, the negative impact of the single failed fuse can be reduced, thus increasing the reliability of the fuse structure. Also the damage to the devices adjacent to the fuse due to the heat generated by the current can be prevented because when the heat generated during the fuse blowing process will be conducted to the adjacent blocks to facilitate heat dissipation.