The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2007

Filed:

Apr. 15, 2003
Applicants:

Thomas Hecht, Dresden, DE;

Albert Birner, Dresden, DE;

Harald Seidl, Feldkirchen, DE;

Uwe Schröder, Dresden, DE;

Stefan Jakschik, Dresden, DE;

Martin Gutsche, Dorfen, DE;

Inventors:

Thomas Hecht, Dresden, DE;

Albert Birner, Dresden, DE;

Harald Seidl, Feldkirchen, DE;

Uwe Schröder, Dresden, DE;

Stefan Jakschik, Dresden, DE;

Martin Gutsche, Dorfen, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for producing a dielectric layer on a substrate made of a conductive substrate material includes reducing a leakage current that flows through defects of the dielectric layer at least by a self-aligning and self-limiting electrochemical conversion of the conductive substrate material into a nonconductive substrate follow-up material in sections of the substrate that are adjacent to the defects. Also provided is a configuration including a dielectric layer with defects, a substrate made of a conductive substrate material, and reinforcement regions made of the nonconductive substrate follow-up material in sections adjacent to the defects.


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