The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Dec. 31, 2003
Do-young Kim, Suwon-si, KR;
Wan-jun Park, Seoul, KR;
Young-soo Park, Suwon-si, KR;
June-key Lee, Suwon-si, KR;
Yo-sep Min, Suwon-si, KR;
Jang-yeon Kwon, Seoul, KR;
Sun-ae Seo, Seoul, KR;
Young-min Choi, Osan-si, KR;
Soo-doo Chae, Seongnam-si, KR;
Do-young Kim, Suwon-si, KR;
Wan-jun Park, Seoul, KR;
Young-soo Park, Suwon-si, KR;
June-key Lee, Suwon-si, KR;
Yo-sep Min, Suwon-si, KR;
Jang-yeon Kwon, Seoul, KR;
Sun-ae Seo, Seoul, KR;
Young-min Choi, Osan-si, KR;
Soo-doo Chae, Seongnam-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
In a thin film semiconductor device realized on a flexible substrate, an electronic device using the same, and a manufacturing method thereof, the thin film semiconductor device and an electronic device include a flexible substrate, a semiconductor chip, which is formed on the flexible substrate, and a protective cap, which seals the semiconductor chip. Durability of the thin film semiconductor device against stress due to bending of the substrate is improved by using the protective cap.