The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Oct. 21, 2004
Applicants:
Tomohiro Okumura, Kadoma, JP;
Kenichiro Suetsugu, Nishinomiya, JP;
Hiroshi Kawazoe, Hirakata, JP;
Mitsuo Saitoh, Neyagawa, JP;
Akio Furusawa, Katano, JP;
Inventors:
Tomohiro Okumura, Kadoma, JP;
Kenichiro Suetsugu, Nishinomiya, JP;
Hiroshi Kawazoe, Hirakata, JP;
Mitsuo Saitoh, Neyagawa, JP;
Akio Furusawa, Katano, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 10/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic part processing method for peeling off a resin coating of an electronic part having a terminal section. The method includes a step of irradiating, with plasma, a coated wire having copper as a principal constituent and a surface coated with a resin.