The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2007
Filed:
Apr. 12, 2001
Sung Soo Chung, San Jose, CA (US);
Sang Hyeon Baeg, Cupertino, CA (US);
Sung Soo Chung, San Jose, CA (US);
Sang Hyeon Baeg, Cupertino, CA (US);
Cisco Technology, Inc., San Jose, CA (US);
Abstract
Testing AC coupled interconnects using boundary scan test methodology. Specially designed AC boundary scan cells and boundary scan logic are used. These are compatible with IEEE Standard 1149.1 testing. An AC_EXTEST method is used to determine the reliability of the AC coupled interconnections. The method includes preloading the test stimulus, initiating the AC_EXTEST instruction, executing the instruction, transferring the instruction results, and evaluating the results. During the test, the TAP controllers of both the driving and receiving ICs are held in the Run-Test/Idle state for the time required to complete execution of the instruction. During this time, the driving IC is applying the AC test stimulus to the interconnections and the receiving IC is sampling the signal. The test may be repeated with different test data and may be run together with a DC EXTEST method to determine the reliability of both the AC and the DC coupled interconnections independently.