The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2007

Filed:

Dec. 01, 2003
Applicants:

Yoshio Okayama, Ogaki, JP;

Hayato Nakashima, Gifu, JP;

Yoshinari Ichihashi, Gifu, JP;

Inventors:

Yoshio Okayama, Ogaki, JP;

Hayato Nakashima, Gifu, JP;

Yoshinari Ichihashi, Gifu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

On a substrate are sequentially formed a first interconnection, a diffusion barrier filmand a second insulating film, and on the upper surface of the second insulating filmis then formed a sacrificial film. Next, a via holeand an interconnection trenchare formed, and on the sacrificial filmare then formed a barrier metal filmand a copper film. CMP for removing the extraneous copper filmand barrier metal filmare conducted in a two-step process, i. e., the first polishing where polishing is stopped on the surface of the barrier metal filmand the second polishing where the remaining barrier metal filmand the tapered sacrificial filmare polished.


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