The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2007

Filed:

Sep. 09, 2003
Applicants:

Chan Ho Park, Chonan-Shi, KR;

Hyun Joo Hwang, Uiwang-shi, KR;

Jae Bong Seo, Iksan-shi, KR;

Young Geun Park, Yongin-shi, KR;

Ho Keun Song, Seongnam-shi, KR;

Inventors:

Chan Ho Park, Chonan-Shi, KR;

Hyun Joo Hwang, Uiwang-shi, KR;

Jae Bong Seo, Iksan-shi, KR;

Young Geun Park, Yongin-shi, KR;

Ho Keun Song, Seongnam-shi, KR;

Assignee:

Mirae Corporation, Chungchongnam-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.


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