The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
May. 13, 2005
Norman A. Card, Lockwood, NY (US);
Robert D. Edwards, Binghamton, NY (US);
John J. Konrad, Endicott, NY (US);
Roy H. Magnuson, Endicott, NY (US);
Timothy L. Wells, Apalachin, NY (US);
Michael Wozniak, Vestal, NY (US);
Norman A. Card, Lockwood, NY (US);
Robert D. Edwards, Binghamton, NY (US);
John J. Konrad, Endicott, NY (US);
Roy H. Magnuson, Endicott, NY (US);
Timothy L. Wells, Apalachin, NY (US);
Michael Wozniak, Vestal, NY (US);
Endicott Interconnect Technologies, Inc., Endicott, NY (US);
Abstract
A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.