The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2007
Filed:
Jan. 23, 2002
Satoshi Sendai, Tokyo, JP;
Kenya Tomioka, Tokyo, JP;
Katsumi Tsuda, Tokyo, JP;
Masayuki Kumekawa, Tokyo, JP;
Koji Mishima, Tokyo, JP;
Satoshi Sendai, Tokyo, JP;
Kenya Tomioka, Tokyo, JP;
Katsumi Tsuda, Tokyo, JP;
Masayuki Kumekawa, Tokyo, JP;
Koji Mishima, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid in which an anode is immersed, a head portion for holding a substrate detachably and bringing a lower surface, to be plated, of the substrate into contact with an overflow surface of the plating liquid held in the plating bath, a drive mechanism for rotating the head portion, and a tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane.