The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2007
Filed:
Dec. 30, 2003
Applicants:
Masahiro Shimada, Kyoto-fu, JP;
Miki Moriyama, Kyoto-fu, JP;
Masanori Murakami, Kyoto-fu, JP;
Naoki Shibata, Aichi-ken, JP;
Inventors:
Masahiro Shimada, Kyoto-fu, JP;
Miki Moriyama, Kyoto-fu, JP;
Masanori Murakami, Kyoto-fu, JP;
Naoki Shibata, Aichi-ken, JP;
Assignee:
Toyoda Gosei Co., Ltd., Aichi-ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring structure for semiconductor device has a wiring layer that includes copper as main component and a crystal grain promotion layer that promotes enlargement in a crystal grain of the wiring layer.