The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2007
Filed:
Nov. 15, 2004
Applicants:
Hsueh-te Wang, Kaohsiung, TW;
Meng-jen Wang, Pingtung, TW;
Chien Liu, Kaohsiung, TW;
Chi-hao Chiu, Pingdung, TW;
Inventors:
Hsueh-Te Wang, Kaohsiung, TW;
Meng-Jen Wang, Pingtung, TW;
Chien Liu, Kaohsiung, TW;
Chi-Hao Chiu, Pingdung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A quad flat flip chip package and a leadframe therefor are provided. A bump connection part is defined by bending or etching the leads of the leadframe. Thus, the bump formed after a reflow process is limited within the bump connection part, and the collapse of the bump can be prevented. Moreover, and the manufacturing costs of the package can be decreased and the process thereof can be simplified.