The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2007
Filed:
Feb. 20, 2004
Takahiro Ishikawa, Toyoake, JP;
Masayuki Shinkai, Ama-gun, JP;
Makoto Miyahara, Nagoya, JP;
Shuhei Ishikawa, Handa, JP;
Nobuaki Nakayama, Obu, JP;
Kazuyoshi Inoue, Nagoya, JP;
Takahiro Ishikawa, Toyoake, JP;
Masayuki Shinkai, Ama-gun, JP;
Makoto Miyahara, Nagoya, JP;
Shuhei Ishikawa, Handa, JP;
Nobuaki Nakayama, Obu, JP;
Kazuyoshi Inoue, Nagoya, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.