The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2007
Filed:
Mar. 15, 2004
Tomoo Yamasaki, Nagano, JP;
Akio Rokugawa, Nagano, JP;
Akihito Takano, Nagano, JP;
Kiyoshi Ooi, Nagano, JP;
Tomoo Yamasaki, Nagano, JP;
Akio Rokugawa, Nagano, JP;
Akihito Takano, Nagano, JP;
Kiyoshi Ooi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A semiconductor device substrate includes a substrate body having a wiring layer. A base is formed by a material that is different from a material of the substrate body. The base supports the substrate body, and has an opening forming portion where a semiconductor element is mounted. A reinforcing member is larger than the opening forming portion, provided in the substrate body at a portion corresponding to the opening forming portion, and reinforces the substrate body at the portion corresponding to the opening forming portion.