The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2007

Filed:

Nov. 26, 2002
Applicants:

Shuzo Sato, Kanagawa, JP;

Takeshi Nogami, Kanagawa, JP;

Zenya Yasuda, Kanagawa, JP;

Masao Ishihara, Tokyo, JP;

Inventors:

Shuzo Sato, Kanagawa, JP;

Takeshi Nogami, Kanagawa, JP;

Zenya Yasuda, Kanagawa, JP;

Masao Ishihara, Tokyo, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25F 3/16 (2006.01); C25F 7/00 (2006.01); B23H 5/06 (2006.01); B23H 3/02 (2006.01); C25F 3/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.


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