The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2006
Filed:
Jul. 09, 2004
Kazuyuki Misumi, Hyogo, JP;
Kazuyuki Misumi, Hyogo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor device includes a substrate, a plurality of bonding fingers formed on the surface of the substrate, and a semiconductor element arranged above the surface of the substrate and having a plurality of connection pads on a surface opposite to a surface facing the substrate. The plurality of connection pads have a connection pad group aligned in the vicinity of a side of the semiconductor element along the same. The plurality of bonding fingers have a bonding finger arranged outside sides adjacent to sides of the semiconductor element along which the connection pad group is arranged. The connection pad group has the connection pad electrically connected to the bonding finger by wire bonding. Therefore, a semiconductor device attaining improved degree of freedom in routing without lowering quality and efficient reduction in its outer dimension is obtained.