The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2006
Filed:
Apr. 02, 2004
Applicants:
Rozalia Beica, Bayport, NY (US);
Neil D. Brown, Merrick, NY (US);
Kai Wang, West Hempstead, NY (US);
Inventors:
Rozalia Beica, Bayport, NY (US);
Neil D. Brown, Merrick, NY (US);
Kai Wang, West Hempstead, NY (US);
Assignee:
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.