The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2006
Filed:
May. 26, 2004
Kenichi Yamaga, Tokyo, JP;
Ken Nakao, Tokyo, JP;
Kenichi Yamaga, Tokyo, JP;
Ken Nakao, Tokyo, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A single-substrate heat-processing apparatus () for a semiconductor processing system includes a process container () configured to accommodate a target substrate (W). A support member () is disposed in the process container () and configured to support the target substrate (W) substantially in a horizontal state, while a bottom surface of the target substrate is exposed. A heating gas supply section () is disposed to generate a heating gas and supply the heating gas toward the bottom surface of the target substrate (W). A distribution member () is disposed within a flow passage of the heating gas supplied from the heating gas supply section (), and configured to improve distribution uniformity of the heating gas onto the bottom surface of the target substrate (W).