The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2006

Filed:

Oct. 03, 2001
Applicants:

Katsuya Fujimura, Kyoto, JP;

Toshiyuki Yokoyama, Kyoto, JP;

Kentaro Shiomi, Osaka, JP;

Akira Motohara, Hyogo, JP;

Inventors:

Katsuya Fujimura, Kyoto, JP;

Toshiyuki Yokoyama, Kyoto, JP;

Kentaro Shiomi, Osaka, JP;

Akira Motohara, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 29/10 (2006.01); H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a semiconductor device, in which a plurality of chip IPs are mounted onto a common semiconductor circuit board, an evaluation method for the same, and a function setting method for the same. Various IP groups can be mounted as chip IPs onto a silicon circuit board. The silicon circuit board includes a silicon substrate, a wiring layer and pads. IPs (chip IPs) are mounted onto the pads by lamination. Means for selecting, switching and setting the functions of the IPs are provided, making the semiconductor device suitable for small-variety mass-production.


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