The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2006

Filed:

Jul. 20, 2004
Applicants:

Makoto Yoshida, Tokyo, JP;

Nobuyuki Okuzawa, Tokyo, JP;

Tomokazu Ito, Tokyo, JP;

Takashi Kudo, Tokyo, JP;

Makoto Otomo, Tokyo, JP;

Akira Sato, Tokyo, JP;

Inventors:

Makoto Yoshida, Tokyo, JP;

Nobuyuki Okuzawa, Tokyo, JP;

Tomokazu Ito, Tokyo, JP;

Takashi Kudo, Tokyo, JP;

Makoto Otomo, Tokyo, JP;

Akira Sato, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a common mode choke coil whose impedance value can be easily adjusted by changing the thickness of an insulation layer for impedance value adjustment appropriately. An insulation layer for impedance value adjustment is formed throughout a principal surface of a first magnetic substrate. Coil patterns and insulation layers are alternately formed on that layer. Parts of the insulation layers other than the insulation layer for impedance value adjustment are removed in either or both of a central region surrounded by the coil patterns and a region around the coil patterns. A resin including magnetic powder is provided on the uppermost insulation layer and the regions where the insulation layers have been removed, and a second magnetic substrate is bonded through a bonding layer.


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