The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Jun. 09, 2004
Tae Soo Kim, Seoul, KR;
Young Hyo Eun, Seoul, KR;
Jicheng Yang, Gilbert, AZ (US);
Jong Wook Park, Seoul, KR;
David Dosung Chun, Tempe, AZ (US);
Hee Yeoul Yoo, Seoul, KR;
Tae Soo Kim, Seoul, KR;
Young Hyo Eun, Seoul, KR;
Jicheng Yang, Gilbert, AZ (US);
Jong Wook Park, Seoul, KR;
David DoSung Chun, Tempe, AZ (US);
Hee Yeoul Yoo, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
Disclosed is a semiconductor device and its manufacturing method. By way of example, the semiconductor device includes a semiconductor die for sensing an external physical quantity, an insulating gel covering the semiconductor die, and an encapsulant which covers the insulating gel while the insulating gel is partially exposed to the exterior. Also, another semiconductor device further includes a dummy plate which has a hole and is seated on the insulating gel. In the manufacturing method of a semiconductor device, a mold having a through hole is provided and the through hole include a structure consisting of a movable pin and a spring for absorbing the expansion of the insulating gel during an encapsulation process. Also, another manufacturing method of a semiconductor device includes performing the encapsulation while the dummy plate is seated on the insulating gel.