The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Jun. 30, 2003
Applicant:
Takashi Kumamoto, Ibaraki-ken, JP;
Inventor:
Takashi Kumamoto, Ibaraki-ken, JP;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 25/065 (2006.01); H05K 1/14 (2006.01); H05K 25/065 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
This invention relates to an apparatus and methods for increasing the microelectronic package density by stacking multiple microelectronic packages in an array and controlling package to package scalability without stressing the carrier substrates and without limiting the number of signal and input/output leads. Specifically, an intermediate substrate having conductive risers therein is used to enable pitch control of the package to package interconnection, control of the standoff distance and act as a microelectronic package stiffener.