The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Jul. 13, 2005
Akira Kuibira, Itami, JP;
Hirohiko Nakata, Itami, JP;
Akira Kuibira, Itami, JP;
Hirohiko Nakata, Itami, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
Heater module, and semiconductor manufacturing equipment in which the heater module is utilized, for raising the cooling speed of a post-heating heater markedly more than conventional, and that can contribute toward bettering and improving productivity, without accompanying scaling-up of and cost increases in the semiconductor manufacturing equipment. The heater module is furnished with heater partfor controlled heating of a wafer placed on its top face, and block partprovided to be shiftable relative to said heater part, for varying heat capacity in total with heater partby abutting on or separating from the reverse surface of heater part. By having the heat capacity of block partbe 20% or more of the total heat capacity of heater partand block part, the heater cooling speed can be made 10° C./min or more.