The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Dec. 28, 2001
Shinya Izumida, Otsu, JP;
Koji Itoh, Otsu, JP;
Minoru Oyama, Chigasaki, JP;
Atsushi Suzuki, Kawagoe, JP;
Shinya Izumida, Otsu, JP;
Koji Itoh, Otsu, JP;
Minoru Oyama, Chigasaki, JP;
Atsushi Suzuki, Kawagoe, JP;
Toray Engineering Company, Limited, Osaka, JP;
Abstract
Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.