The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Jan. 30, 2003
Eiji Nakamura, Naka-gun, JP;
Hidemitsu Takaoka, Naka-gun, JP;
Yasuhiko Tashiro, Tsukuba, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Mitsubishi Materials Kobe Tools Corporation, Hyogo-Ken, JP;
Abstract
A surface-coated cutting tool member exhibiting a superior tool life due to a hard coating layer thereof is provided. The surface-coated cutting tool member includes a tungsten carbide based cemented carbide substrate, a titanium carbonitride based cermet substrate, or a cubic boron nitride based sintered substrate; and a hard coating layer of a nitride compound containing titanium and yttrium, which is formed on a surface of the substrate using a physical vapor deposition method in an overall average thickness of 1 to 15 μm. The hard coating layer has a component concentration profile in which maximum Y component containing points (minimum Ti component containing points) and points without Y component (TiN points) appear alternatingly and repeatedly at a predetermined interval in a direction of thickness of the hard coating layer, and the amount of contained Y component is continuously changed from the maximum Y component containing points to the points without Y component and from the points without Y component to the maximum Y component containing points, the maximum Y component containing points satisfy a composition formula of (TiY)N (where X indicates an atomic ratio of 0.005 to 0.15), and a distance between one of the maximum Y component containing points and adjacent one of the points without Y component is from 0.01 to 0.1 μm.