The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2006

Filed:

May. 03, 2005
Applicants:

Chun-hsien Lin, Hsin-Chu, TW;

Ping-hsu Chen, Hsinchu, TW;

Sunny Wu, Doulion, TW;

Francis Ko, Taichung, TW;

Inventors:

Chun-Hsien Lin, Hsin-Chu, TW;

Ping-Hsu Chen, Hsinchu, TW;

Sunny Wu, Doulion, TW;

Francis Ko, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for monitoring a processing tool in a semiconductor manufacturing facility includes selecting key hardware parameters for a virtual sensor system based on manufacturing data associated with a fabrication tool and collecting manufacturing data associated with the fabrication tool. The method further includes dynamically maintaining the virtual sensor system during the manufacture of a plurality of semiconductor products and using the virtual sensor system and the collected manufacturing data for predicting a condition of a semiconductor product after being processed by the fabrication tool.


Find Patent Forward Citations

Lin, Chun-Hsien. (2006). Method and apparatus to enable accurate wafer prediction (U.S. Patent No. 7144297). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7144297

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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