The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Jul. 29, 2004
Applicants:
Wei-chih Wang, Kaohsiung, TW;
Kuang-lin Lo, Kaohsiung, TW;
Yun-lung Chang, Kaohsiung, TW;
Inventors:
Assignee:
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/77 (2006.01);
U.S. Cl.
CPC ...
Abstract
A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a molding flowability sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates a mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the molding flowability sensor for measuring the molding flowability of the instant molding flow at the mold-cavity surface of the mold cavity is provided at the mold-cavity surface of the mold cavity.