The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Sep. 29, 2004
Hsieh-kun Lee, Tu-Cheng, TW;
Wan-lin Xia, Shenzhen, CN;
Bao-chun Chen, Shenzhen, CN;
Bo-yong Yang, Shenzhen, CN;
Jin-song Feng, Shenzhen, CN;
Tao LI, Shenzhen, CN;
Hsieh-Kun Lee, Tu-Cheng, TW;
Wan-Lin Xia, Shenzhen, CN;
Bao-Chun Chen, Shenzhen, CN;
Bo-Yong Yang, Shenzhen, CN;
Jin-Song Feng, Shenzhen, CN;
Tao Li, Shenzhen, CN;
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Guangdong Province, CN;
Foxconn Technology Co., Ltd., , TW;
Abstract
A heat dissipating device assembly for an electronic components (), includes a heat sink () for contacting the electronic component, and a locking device () and a back plate unit () for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module () located around the electronic component for supporting the heat sink thereon, and a clip () pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.