The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Apr. 14, 2003
Hiroshi Horikoshi, Kanagawa, JP;
Takeshi Nogami, Kanagawa, JP;
Shuzo Sato, Kanagawa, JP;
Shingo Takahashi, Kanagawa, JP;
Naoki Komai, Kanagawa, JP;
Kaori Tai, Kanagawa, JP;
Hiizu Ohtorii, Kanagawa, JP;
Hiroshi Horikoshi, Kanagawa, JP;
Takeshi Nogami, Kanagawa, JP;
Shuzo Sato, Kanagawa, JP;
Shingo Takahashi, Kanagawa, JP;
Naoki Komai, Kanagawa, JP;
Kaori Tai, Kanagawa, JP;
Hiizu Ohtorii, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A polishing method and a polishing apparatus by which excess portions of a metallic filmcan be removed easily and efficiently in planarizing the metallic filmby polishing and which is high in accuracy of polishing, are provided. Also, a method of manufacturing a semiconductor device by use of the polishing method and the polishing apparatus is provided. A substrateprovided with the metallic filmand a counter electrodeare disposed oppositely to each other in an electrolytic solution E, an electric current is passed to the metallic filmthrough the electrolytic solution E, and the surface of the metallic filmis polished with a hard pad