The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Nov. 06, 2002
Xinming Wang, Tokyo, JP;
Kenichi Abe, Tokyo, JP;
Koji Mishima, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A substrate processing apparatus and method which employs the so-called batch processing method of processing a plurality of substrates simultaneously, thereby increasing the throughput, and which can carry out processing, such as electroless plating, stably and securely with a relatively simple apparatus. The substrate processing apparatus includes: a processing bath () for holding a processing liquid (); and a substrate holder () which is vertically movable relative to the processing bath () and which includes a plurality of substrate holding portions () for holding a plurality of substrates (W) in parallel. Each substrate holding portion () has a substrate stage () and a substrate presser (), which can move close to or away from each other and can grip therebetween a peripheral portion of a substrate to thereby hold the substrate with its back surface sealed, and has a heating medium flow passage () for passing a heating medium therethrough so as to regulate the temperature of the substrate holding portion ().