The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Jan. 21, 2004
Michael H. Bunyan, Chelmsford, MA (US);
Thomas A. Clement, Lexington, MA (US);
John J. Hannafin, Westford, MA (US);
Marc E. Larosee, Winthrop, MA (US);
Kent M. Young, Carlisle, MA (US);
Michael H. Bunyan, Chelmsford, MA (US);
Thomas A. Clement, Lexington, MA (US);
John J. Hannafin, Westford, MA (US);
Marc E. LaRosee, Winthrop, MA (US);
Kent M. Young, Carlisle, MA (US);
Parker-Hannifin Corporation, Cleveland, OH (US);
Abstract
A polishing pad or other shaped article for the electrochemical mechanical polishing (ECMP) of a workpiece. The article includes an electrically-conductive compound which is formed into a layer. The compound is formulated as an admixture which includes a polymeric component forming a continuous phase in the layer, and an electrically-conductive filler component forming a discrete phase within the continuous phase. With the workpiece and the layer being electrically connected and with an electrical bias being applied between the workpiece and the layer, the bias being capable of activating an electrochemical reaction, the compound exhibits an overpotential for the activation of the reaction greater than the bias.