The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Feb. 17, 2005
Yutaka Kondo, Tachikawa, JP;
Yutaka Kondo, Tachikawa, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
A wire bonding apparatus that include a piezoelectric elementprovided near the capillary attachment portion of a bonding armso that a capillaryvibrates in the axial direction of the bonding arm, the piezoelectric elementbeing driven by a piezoelectric element driving power source. The wire bonding apparatus further includes a detectorand a bonding arm control circuit, wherein the detectordetects the voltage or current generated by the piezoelectric elementwhen the capillaryis lowered and contacts the object of bonding, and the bonding arm control circuitcontrols the lowering motion of the bonding armin accordance with the changes in the voltage or current detected by this detector