The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Jul. 29, 2004
Koichi Hirano, Hirakata, JP;
Seiichi Nakatani, Hirakata, JP;
Hiroyuki Handa, Hirakata, JP;
Tsunenori Yoshida, Yawata, JP;
Yoshihisa Yamashita, Kyoto, JP;
Hiroyuki Ishitomi, Takatsuki, JP;
Koichi Hirano, Hirakata, JP;
Seiichi Nakatani, Hirakata, JP;
Hiroyuki Handa, Hirakata, JP;
Tsunenori Yoshida, Yawata, JP;
Yoshihisa Yamashita, Kyoto, JP;
Hiroyuki Ishitomi, Takatsuki, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A circuit component built-in module can be produced by filling a conducting material in through holes of a sheet-like member, stacking the sheet-like member and a metal foil on a circuit component package, and applying heat and pressure to embed the circuit component in the sheet-like member, and patterning the metal foil. The circuit component package includes a mounting member with substrate and wiring pattern and a circuit component. The circuit component includes a component body and external electrode, with the component body being thinner at a portion on which the external electrode is provided. The external electrode is provided on a surface of the circuit component that is opposed to the mounting member, and the component body is in contact with the mounting member.