The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2006

Filed:

Nov. 23, 2004
Applicants:

Tetsuo Yamada, Ube, JP;

Keigo Nagao, Ube, JP;

Chisen Hashimoto, Ube, JP;

Inventors:

Tetsuo Yamada, Ube, JP;

Keigo Nagao, Ube, JP;

Chisen Hashimoto, Ube, JP;

Assignee:

UBE Industries, Ltd., Yamaguchi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 17/00 (2006.01); H05K 3/10 (2006.01); B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of producing a thin film bulk acoustic resonator having a piezoelectric layer, a first electrode joined to a first surface of the piezoelectric layer, and a second electrode joined to a second surface of the piezoelectric layer, which is located at the opposite side to the first surface, including the steps of forming a pit on a surface of a substrate; filling the pit with a sacrificial layer; polishing a surface of the sacrificial layer so that the RMS variation of a height of the surface of the sacrificial layer is equal to 25 nm or less; forming the first electrode over a partial area of the surface of the sacrificial layer and a partial area of the surface of the substrate; forming the piezoelectric layer on the first electrode so that RMS variation of a height of the second surface of the piezoelectric layer is equal to 5% or less of a thickness of the piezoelectric layer; forming the second electrode on the piezoelectric layer; and removing the sacrificial layer from the inside of the pit by etching.


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