The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2006
Filed:
Feb. 15, 2005
Toshio Miyamoto, Kodaira, JP;
Asao Nishimura, Kokubunji, JP;
Koki Noguchi, Tokyo, JP;
Satoshi Michishita, Tokorozawa, JP;
Masashi Horiguchi, Kawasaki, JP;
Masaharu Kubo, Hachioji, JP;
Kazuyoshi Shiba, Kodaira, JP;
Toshio Miyamoto, Kodaira, JP;
Asao Nishimura, Kokubunji, JP;
Koki Noguchi, Tokyo, JP;
Satoshi Michishita, Tokorozawa, JP;
Masashi Horiguchi, Kawasaki, JP;
Masaharu Kubo, Hachioji, JP;
Kazuyoshi Shiba, Kodaira, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.