The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2006
Filed:
Jul. 20, 2004
Applicant:
Vernon M. Williams, Meridian, ID (US);
Inventor:
Vernon M. Williams, Meridian, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/20 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods for fabricating semiconductor device components include use of programmed material consolidation processes to form the substrates or conductive elements thereof. The features that are formed by such processes may include multiple adjacent, mutually adhered regions. A machine vision system may be used so that the programmed material consolidation system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which an element is to be fabricated.