The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2006
Filed:
Oct. 28, 2004
Lih-tyng Hwang, Crystal Lake, IL (US);
Robert B. Lempkowski, Elk Grove, IL (US);
LI LI, Scottsdale, AZ (US);
Lih-Tyng Hwang, Crystal Lake, IL (US);
Robert B. Lempkowski, Elk Grove, IL (US);
Li Li, Scottsdale, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An embedded multilayer printed circuit includes a first ground plane () of a multilayer printed circuit board and an embedded layer. The embedded layer includes a co-planar capacitor (), a distributed inductor (), and a capacitive plate () circuit. The capacitive plate is a plate of a vertical capacitor (). The embedded layer further includes a node () of the embedded multilayer printed circuit that is formed by a connection of a first terminal of the co-planar capacitor and a first terminal of the first distributed inductor, and in some embodiments, the first capacitive plate is also connected to the node. A second terminal of one of the co-planar capacitor and the distributed inductor is connected to the first ground plane.