The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2006

Filed:

Sep. 16, 2004
Applicants:

Francis J. Carney, Gilbert, AZ (US);

Jeffrey Pearse, Chandler, AZ (US);

Stephen St. Germain, Scottsdale, AZ (US);

Inventors:

Francis J. Carney, Gilbert, AZ (US);

Jeffrey Pearse, Chandler, AZ (US);

Stephen St. Germain, Scottsdale, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A power semiconductor package, including a leadframe having at least one first terminal, a second terminal and a third terminal. The package also includes a semiconductor power die having a bottom surface defining a first current carrying electrode and a top surface on which a first metalized region defining a second current carrying electrode and a second metalized region defining a control electrode are disposed, the bottom surface being coupled to the leadframe such that the first terminal is electrically connected to the first current carrying electrode. A clip is also coupled to the first metalized region defining the second current carrying electrode and to the second terminal such that it is electrically coupled to the second current carrying electrode.


Find Patent Forward Citations

Loading…