The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2006
Filed:
Jan. 10, 2003
Rajesh Baskaran, Kalispell, MT (US);
Bioh Kim, Kalispell, MT (US);
Linlin Chen, Plano, TX (US);
Lyndon W Graham, Hillsboro, OR (US);
Rajesh Baskaran, Kalispell, MT (US);
Bioh Kim, Kalispell, MT (US);
Linlin Chen, Plano, TX (US);
Lyndon W Graham, Hillsboro, OR (US);
Semitool, Inc., Kalispell, MT (US);
Abstract
The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and the metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.